FirePro W8100


Технические характеристики FirePro W8100:

Name Hawaii
Process Size 28 nm
Transistors 6,200 million
Die Size 438 mm²
Released Jun 23rd, 2014
Production Status Active
Bus Interface PCIe 3.0 x16
Clock 824 MHz
Memory Clock 1250 MHz 5000 MHz effective
Memory Size 8192 MB
Memory Type GDDR5
Memory Bus 512 bit
Bandwidth 320 GB/s
Shading Units 2560
Tmus 160
Rops 64
Compute Units 40
Pixel Rate 52.7 GPixel/s
Texture Rate 132 GTexel/s
Floating Point Performance 4,219 GFLOPS
Tdp 220 W
Outputs 4x DisplayPort1x SDI
Power Connectors 2x 6-pin
Board Number C675
Directx 12.0
Opengl 4.4
Opencl 2.0
Shader Model 5.0

Отзывы и обзоры FirePro W8100: